Source: Jibang Storage Market

On April 22, Micron announced that its full range of vehicle-scale memory and storage solutions have been validated by Qualcomm Technologies' Snapdragon® Digital Chassis™ platform.

Micron's low-power LPDDR5X memory, universal flash UFS 3.1, Xccela™ flash, and four-wire serial peripheral interface NOR Flash are pre-integrated into the Snapdragon® Cockpit platform, Snapdragon Ride™ platform, and Snapdragon Ride™ Flex's new generation of Snapdragon automotive solutions and modules, including system-on-chip (SoC), are designed to meet the growing demands of AI workloads today and in the future.

Micron Automotive LPDDR5X is a flagship memory solution for applications that require high speed and low power consumption. LPDDR5X is backward compatible with LPDDR5 at a rate of 6.4 Gb/s, which has been previously verified by Qualcomm. Qualcomm's next-generation Snapdragon automotive SoC is the first SoC product family to support LPDDR5.

Micron UFS 3.1 storage doubles read performance and improves continuous write performance by 50%, enabling faster device startup, over-the-air (OTA) updates, faster application response, and a smoother overall user experience.

Micron Xccela™ Flash memory is the industry's leading high-performance NOR offering up to five times the performance and three times the power efficiency compared to other solutions.

Four-wire SPI-NOR flash provides fast code execution capabilities and high reliability for applications such as startup code and program code.

Micron's volatile and non-volatile solutions as described above have been successfully applied to Qualcomm's next-generation Snapdragon Cockpit platform.