Driven by emerging technologies such as AI and high-performance computing, the importance of advanced manufacturing processes in the foundry industry has become increasingly prominent. Recently, the industry ushered in a new development: Intel announced that the Intel 4 process node has been mass-produced. At the same time, TSMC and Samsung are also actively deploying advanced process technology.

The Intel Intel 4 process node has been mass-produced

On October 15, the official public account of "Intel China" announced that Intel has recently begun large-scale production of Intel 4 process nodes using extreme ultraviolet lithography (EUV) technology. According to the official, Intel is promoting the "four years five process nodes" plan with strong execution, and will be used for a new generation of leading products to meet the exponential growth of computing power needs of the "core economy" driven by AI.

As Intel's first process node to be produced using extreme ultraviolet lithography, Intel 4 delivers significant improvements in performance, energy efficiency and transistor density over previous nodes. Intel previously introduced the Intel 4 process at the ON Technology Innovation Summit held in September.

Intel says Intel 4 achieves twice the area miniaturization compared to lntel 7, brings a high-performance logic library, and introduces several innovations.

Specifically, Intel 4 simplifies the process of EUV lithography technology; Lntel 4 is optimized for high performance computing applications to support low voltage (<0.65V) and high voltage (> 1.1V) operation. intel 4 improves iso power performance by more than 20% compared to lntel 7; High density MIM (metal-insulator-metal) capacitors achieve superior power performance.

Intel's "four years and five process nodes" plan is progressing smoothly, and its process progress is as follows:

At present, Intel 7 and Intel 4 have achieved mass production; Intel 3 is on track, with a target of the end of 2023.

The Intel 20A and Intel 18A, with Ribbon FETs all around gate transistors and PowerVia backside power, are also well on their way, targeting 2024. Intel will soon launch the Intel 18A Process Design Kit (PDK) for Intel Foundry Services (IFS) customers.

Intel ® Core ™Ultra processors with Intel 4-process nodes, codenamed Meteor Lake, will be released on December 14 this year, paving the way for the AIPC era.

Sierra Forest, an energy-efficient E-core Xeon processor using Intel's 3-process nodes, will be available in the first half of 2024, followed by Granite Rapids, a high-performance P-core xeon processor.

Samsung 2nm process mass production detailed plan announced

Samsung has mass-produced the second generation of 3nm chips, and will continue to power 2nm chips in the future.

Earlier on June 28, Samsung Electronics announced its latest Foundry technology innovation and business strategy at the 7th Samsung Foundry Forum (SFF) in 2023.

In the era of artificial intelligence, Samsung's wafer foundry program is based on GAA's advanced process technology to provide strong support for customers' needs in artificial intelligence applications. To this end, Samsung announced a detailed plan for the mass production of 2nm process and performance levels, and plans to achieve the mass production of 2nm process in the mobile field in 2025, and expand to HPC and automotive electronics in 2026 and 2027, respectively.

According to Samsung, the 2nm process (SF2) offers 12% higher performance, 25% higher efficiency and 5% less area than the 3nm process (SF3).

In addition, according to media reports in September, Samsung is preparing to ensure the production of the next generation of EUV lithography machine High-NA, which is expected to launch a prototype later this year and be officially supplied next year.

TSMC will enter mass production of 2nm in 2025

Since the beginning of this year, TSMC has introduced its latest advanced semiconductor manufacturing process roadmap in Santa Clara, California, USA, and Taiwan, China, covering various processes for 3nm and 2nm process nodes.

The 3nm" family "currently planned by TSMC are N3, N3E, N3P, N3X, N3 AE, of which N3 is the basic version; N3E is an improved version, the cost is further optimized; N3P performance will be further improved, and production is planned for the second half of 2024; N3X focuses on high-performance computing equipment and plans to enter mass production in 2025. The N3 AE is designed specifically for the automotive sector with enhanced reliability, which will help customers reduce time to market by two to three years.

In terms of 2nm, TSMC expects the N2 process to enter mass production in 2025. According to TSMC, at the same power, N2 speed is 15% higher than N3E, or 30% lower power consumption, and the density is 1.15 times that of the original. In September, the media revealed that TSMC has set up a 2nm task team to sprint 2nm trial production and mass production, which is expected to achieve risky trial production next year and mass production in 2025.

In order to ensure the smooth development of 2nm process technology, TSMC has begun to pursue the field of upstream equipment. TSMC announced on September 12 that it will acquire a 10% stake in IMS Nanofabrication (hereinafter referred to as "IMS"), a subsidiary of Intel, for no more than $432.8 million. IMS is a company focused on the development and production of electron beam lithography machines, whose products are widely used in semiconductor manufacturing, optical component manufacturing, MEMS manufacturing and other fields, with high resolution, high precision, high speed and other advantages. The industry believes that TSMC's acquisition of IMS can ensure the technical development of key equipment and meet the supply needs of 2nm commercialization.