Visual Inspection

Appearance testing refers to confirming the number of chips received, inner packaging, humidity indication, desiccant requirements, and appropriate outer packaging.

01.

Key Functional Testing

Key functional testing refers to conducting various necessary logic or signal status tests under specific working conditions (i.e. normal operating environment of the device, usually at room temperature) and the normal working state of the device.

02.

X Ray

X-ray testing is a real-time non-destructive analysis to inspect the hardware components inside components, mainly checking the chip's pin frame, wafer size, wire binding diagram, ESD damage and holes. Customers can provide high-quality products for comparative inspection.

03.

Cover Opening Inspection

Opening the cover (unsealing) mainly involves using instruments to corrode the packaging on the surface of the chip, checking for the presence of wafers inside, the size of the wafers, the manufacturer's logo, copyright year, and wafer code, in order to determine the authenticity of the chip.

04.

Weldability Testing

According to the testing standards for solderability testing, this test mainly tests whether the soldering ability of chip pins meets the standard.

05.

Programming Testing

Programming burning can support the detection of 103477 chips from 405 brand manufacturers, including EPROM, parallel and serial EEPROM, FPGA, configuration of serial PROM, flash memory, BPROM, NOVRAM, SPLD, CPLD, EPLD, microcontroller, MCU, and standard logic device testing.

06.